Company research, development, production of integrated circuit packaging products have DIP, SOP, SSOP, TSSOP, MSOP, QFP, LQFP, eLQFP, SIP, the TO, SOT, BGA, FC, TSV, LED, MEMS, and so on more than 10 series over 180 varieties, capacity and sales in the domestic packaging testing companies. 2. Packaging products are widely used in industrial control, consumer electronics, mobile communications and other fields, products meet the requirement of green environmental protection, and most companies for domestic integrated circuit packaging products. Company has a state-level enterprise technology center in gansu province and microelectronics packaging engineering technology research center, built with microelectronics engineering research laboratory in gansu province, gansu province, semiconductor lighting engineering laboratory and the reliability of the domestic first-class laboratory.